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RM 60: Collins' Dave Hillman about Solder Voiding

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Sinopsis

Solder voiding has been with us longer than we know. Modern x-ray inspection technology has allowed assemblers to see and quantify voiding. Metallurgical expert Dave Hillman from Collins Aerospace explains the causes and possible remedies for solder voiding. Dave Hillman is a metallurgical engineer in the Advanced Operations Engineering Department of Collins Aerospace in Cedar Rapids, Iowa. He serves as a consultant to manufacturing on material and processing problems. He served as a subject matter expert for the Lead-free Manhattan Project in 2009. He has published numerous technical papers and was presented with the 2008 SMTA International Conference on Soldering & Reliability “Best of Conference” award and was the recipient of the SMTA “Member of Technical Distinction” Award. Dave was awarded the Da Vinci medal as a Rockwell Engineer of the Year. He serves as the Chairman of the IPC JSTD-002 Solderability committee. He’s also a member of the SMTA where he serves on the SMTA Journal and Soldering &